Glass-based, 3D Passive RF Devices Innovator Raises $12 Million in Funding

Glass-based, 3D Passive RF Devices Innovator Raises $12 Million in Funding

28 ghz bandpass filters 5g and beyond e1528734923113 636987636615207983 Glass-based, 3D Passive RF Devices Innovator Raises $12 Million in Funding

3D Glass Solutions (3DGS), a leading innovator of glass-based, three-dimensional (3D) passive RF devices, has raised $12 million in series B funding, bringing the company’s total equity funding to more than $19 million. Led by Nagase & Company, Ltd. (Nagase), a Japanese conglomerate specializing in next-generation chemistries and technologies across multiple market sectors, series B investment participants also include Sun Mountain Capital, Murata Manufacturing Co., Ltd., and Lockheed Martin Ventures. With the successful close of this round of equity funding, 3DGS is now well-positioned for continued manufacturing expansion and acceleration of its technology roadmap.

3DGS provides unique design and manufacturing technologies to produce glass-based RF passive and photonic devices with high-performance functionality necessary for next-generation, high-frequency wireless communication. 3DGS’ patented glass-ceramic material, APEX® glass, enables the engineering and production of high-frequency 3D passive components which are integral to the efficiency of RF circuits and designs operating at very high frequency including 5G commercial and infrastructure systems, autonomous vehicle technology, high-speed data, photonics, and military/aerospace.

With an increasing order backlog and imminent move to a new 20,000 sq. ft. manufacturing facility, 3DGS is well on the way to enabling broad GHz spectrum capability for multiple applications. They are expanding manufacturing operations, ramping to volume production and adding engineering resources for RF design and component manufacture. RF and microwave technology is ubiquitous and system designers are finding it more difficult than ever before to integrate more RF bands and increase functionality. 3DGS components solve system designers’ need for high performance, small form factors, and optimized component integration so that full performance potential and efficient, powerful connectivity in the GHz spectrum can be achieved. 

Click here to learn more about 3D Glass Solutions (3DGS).